Part Details for DE28C256-350 by LSI Corporation
Overview of DE28C256-350 by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for DE28C256-350
DE28C256-350 CAD Models
DE28C256-350 Part Data Attributes
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DE28C256-350
LSI Corporation
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Datasheet
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DE28C256-350
LSI Corporation
EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | DIP, DIP28,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 350 ns | |
| Additional Feature | AUTOMATIC WRITE;PAGE WRITE | |
| Command User Interface | NO | |
| Data Polling | YES | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 64 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.00025 A | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | NO |
Alternate Parts for DE28C256-350
This table gives cross-reference parts and alternative options found for DE28C256-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DE28C256-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8852509XA | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Teledyne e2v | DE28C256-350 vs 5962-8852509XA |
| AM28C256-350DC | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | DE28C256-350 vs AM28C256-350DC |
| X28C256DMB-35 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 | Xicor Inc | DE28C256-350 vs X28C256DMB-35 |
| X28C256PI-35 | EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 | Xicor Inc | DE28C256-350 vs X28C256PI-35 |
| PQ28C256-350 | EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28 | LSI Corporation | DE28C256-350 vs PQ28C256-350 |
| DM28C256-350 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28 | LSI Corporation | DE28C256-350 vs DM28C256-350 |
| AM28C256-350DCB | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | DE28C256-350 vs AM28C256-350DCB |
| AT28C256E-35DM/883 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Atmel Corporation | DE28C256-350 vs AT28C256E-35DM/883 |
| 5962-8852501XX | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 | LSI Corporation | DE28C256-350 vs 5962-8852501XX |
| AM28C256-355DCB | EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | DE28C256-350 vs AM28C256-355DCB |