Datasheets
X28C256DMB-35 by: Xicor Inc

EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28

Part Details for X28C256DMB-35 by Xicor Inc

Overview of X28C256DMB-35 by Xicor Inc

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Part Details for X28C256DMB-35

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X28C256DMB-35 Part Data Attributes

X28C256DMB-35 Xicor Inc
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X28C256DMB-35 Xicor Inc EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XICOR INC
Package Description DIP, DIP28,.6
Reach Compliance Code unknown
Access Time-Max 350 ns
Additional Feature 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
Command User Interface NO
Data Polling YES
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 37.15 mm
Memory Density 262144 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Page Size 64 words
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.9 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit YES
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for X28C256DMB-35

This table gives cross-reference parts and alternative options found for X28C256DMB-35. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256DMB-35, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
X28256DM-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc X28C256DMB-35 vs X28256DM-35
X28C256P-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc X28C256DMB-35 vs X28C256P-35
M38510/26101BXX 32KX8 EEPROM 5V, 350ns, DIP28, 1.490 X 0.610 INCH, 0.232 HEIGHT, DIP-28 Intersil Corporation X28C256DMB-35 vs M38510/26101BXX
X28256D-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc X28C256DMB-35 vs X28256D-35
X28256PI-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc X28C256DMB-35 vs X28256PI-35
AM28C256-355DC EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD X28C256DMB-35 vs AM28C256-355DC
AT28C256E-35DM/883 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation X28C256DMB-35 vs AT28C256E-35DM/883
5962-8852501XA EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 LSI Corporation X28C256DMB-35 vs 5962-8852501XA
AM28C256-350DC EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD X28C256DMB-35 vs AM28C256-350DC
X28C256PI-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc X28C256DMB-35 vs X28C256PI-35
Part Number Description Manufacturer Compare
X28256PI-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc X28C256DMB-35 vs X28256PI-35
AM28C256-355DCB EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD X28C256DMB-35 vs AM28C256-355DCB
AT28C256E-35DM/883 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation X28C256DMB-35 vs AT28C256E-35DM/883
AM28C256-350DCB EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD X28C256DMB-35 vs AM28C256-350DCB
X28256DI-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc X28C256DMB-35 vs X28256DI-35
X28256D-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc X28C256DMB-35 vs X28256D-35
PQ28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28 LSI Corporation X28C256DMB-35 vs PQ28C256-350
X28C256PMB-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc X28C256DMB-35 vs X28C256PMB-35
AM28C256-350DC EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD X28C256DMB-35 vs AM28C256-350DC
5962-8852509XX EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Atmel Corporation X28C256DMB-35 vs 5962-8852509XX

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