Datasheets
CM28C256-350 by: LSI Corporation

EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28

Part Details for CM28C256-350 by LSI Corporation

Overview of CM28C256-350 by LSI Corporation

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Part Details for CM28C256-350

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CM28C256-350 Part Data Attributes

CM28C256-350 LSI Corporation
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CM28C256-350 LSI Corporation EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28
Part Life Cycle Code Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC
Package Description ,
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 350 ns
Additional Feature AUTOMATIC WRITE;PAGE WRITE
JESD-30 Code R-CDIP-T28
Memory Density 262144 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for CM28C256-350

This table gives cross-reference parts and alternative options found for CM28C256-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CM28C256-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M38510/26101BXA EEPROM, 32KX8, 350ns, Parallel, CMOS, 1.490 X 0.610 INCH, 0.232 HEIGHT, DIP-28 LSI Corporation CM28C256-350 vs M38510/26101BXA
X28256DI-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc CM28C256-350 vs X28256DI-35
X28C256DI-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc CM28C256-350 vs X28C256DI-35
X28C256PMB-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc CM28C256-350 vs X28C256PMB-35
X28256PI-35 EEPROM, 32KX8, 350ns, Parallel, NMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc CM28C256-350 vs X28256PI-35
DQ28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28 LSI Corporation CM28C256-350 vs DQ28C256-350
5962-8852501XX EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 LSI Corporation CM28C256-350 vs 5962-8852501XX
AT28C256E-35DM/883 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation CM28C256-350 vs AT28C256E-35DM/883
X28C256PI-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, PDIP28, PLASTIC, DIP-28 Xicor Inc CM28C256-350 vs X28C256PI-35
AM28C256-350DC EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD CM28C256-350 vs AM28C256-350DC
Part Number Description Manufacturer Compare
M38510/26101BXA EEPROM, 32KX8, 350ns, Parallel, CMOS, 1.490 X 0.610 INCH, 0.232 HEIGHT, DIP-28 LSI Corporation CM28C256-350 vs M38510/26101BXA
CM28C256-350/B EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28 LSI Corporation CM28C256-350 vs CM28C256-350/B
5962-8852509XX EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v CM28C256-350 vs 5962-8852509XX
5962-8852509XA EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Xicor Inc CM28C256-350 vs 5962-8852509XA
CE28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28 LSI Corporation CM28C256-350 vs CE28C256-350
5962-8852501XA EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 LSI Corporation CM28C256-350 vs 5962-8852501XA
5962-8852509XX EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, CERAMIC, DIP-28 Atmel Corporation CM28C256-350 vs 5962-8852509XX
5962-8852509XA EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LSI Corporation CM28C256-350 vs 5962-8852509XA
5962-8852509XA EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Teledyne e2v CM28C256-350 vs 5962-8852509XA
AM28C256-350DC EEPROM, 32KX8, 350ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD CM28C256-350 vs AM28C256-350DC

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