Memory
CAT27C210DI-20
Catalyst Semiconductor
Description: UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, CERDIP-40

Overview of CAT27C210DI-20 by Catalyst Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Consumer Electronics Education and Research Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

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Part Data Attributes for CAT27C210DI-20 by Catalyst Semiconductor

CAT27C210DI-20
Catalyst Semiconductor
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CATALYST SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP40,.6
Pin Count
40
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
200 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T40
JESD-609 Code
e0
Length
52.324 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
16
Number of Functions
1
Number of Terminals
40
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.72 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. CAT27C210DI-20
    Catalyst Semiconductor
    UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, CERDIP-40
    VS

Alternate Parts for CAT27C210DI-20

This table gives cross-reference parts and alternative options found for CAT27C210DI-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CAT27C210DI-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM27C1024-200/BQA UVPROM, 64KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD CAT27C210DI-20 vs AM27C1024-200/BQA
AM27C1024-200DE UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion CAT27C210DI-20 vs AM27C1024-200DE
NM27C210Q200 IC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM Texas Instruments CAT27C210DI-20 vs NM27C210Q200
NM27C210QE200 IC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM National Semiconductor Corporation CAT27C210DI-20 vs NM27C210QE200
AT27C1024L-20DM/883 UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation CAT27C210DI-20 vs AT27C1024L-20DM/883
AM27C1024-205DCB UVPROM, 64KX16, 200ns, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 AMD CAT27C210DI-20 vs AM27C1024-205DCB
TMS27C210-20JL 64KX16 UVPROM, 200ns, CDIP40, WINDOWED, CERDIP-40 Texas Instruments CAT27C210DI-20 vs TMS27C210-20JL
AM27C1024-200DIB UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD CAT27C210DI-20 vs AM27C1024-200DIB
AT27C1024-20DI UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation CAT27C210DI-20 vs AT27C1024-20DI
AM27C1024-200DI UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD CAT27C210DI-20 vs AM27C1024-200DI
Part Number Description Manufacturer Compare
AT27HC1024-90KI UVPROM, 64KX16, 90ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 Atmel Corporation CAT27C210DI-20 vs AT27HC1024-90KI
AM27C1024-125DI UVPROM, 64KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD CAT27C210DI-20 vs AM27C1024-125DI
NMC27C1024V170 64KX16 UVPROM, 170ns, PQCC44, PLASTIC, LCC-44 Texas Instruments CAT27C210DI-20 vs NMC27C1024V170
AM27C1024-85LIB UVPROM, 64KX16, 85ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD CAT27C210DI-20 vs AM27C1024-85LIB
TMS27C210A-250JE 64KX16 UVPROM, 250ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments CAT27C210DI-20 vs TMS27C210A-250JE
AT27HC1024-90LM UVPROM, 64KX16, 90ns, CMOS, CQCC44, CERAMIC, LCC-44 Atmel Corporation CAT27C210DI-20 vs AT27HC1024-90LM
M27C1024-70XF6 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics CAT27C210DI-20 vs M27C1024-70XF6
M27C1024-20XF6 64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics CAT27C210DI-20 vs M27C1024-20XF6
NM27LV210V300 IC 64K X 16 UVPROM, 300 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM National Semiconductor Corporation CAT27C210DI-20 vs NM27LV210V300
NMC27C1024Q150 64KX16 UVPROM, 150ns, CDIP40, CERAMIC, DIP-40 Texas Instruments CAT27C210DI-20 vs NMC27C1024Q150

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