Datasheets
AT27C1024L-20DM/883 by: Atmel Corporation

UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40

Part Details for AT27C1024L-20DM/883 by Atmel Corporation

Overview of AT27C1024L-20DM/883 by Atmel Corporation

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Aerospace and Defense

Available Datasheets

Part # Manufacturer Description Datasheet
54H20DM/B Rochester Electronics LLC 54H20DM/B
9020DM/B Rochester Electronics LLC 9020 - FF/Latch
9320DM Rochester Electronics LLC 9320DM

Part Details for AT27C1024L-20DM/883

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AT27C1024L-20DM/883 Part Data Attributes

AT27C1024L-20DM/883 Atmel Corporation
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AT27C1024L-20DM/883 Atmel Corporation UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code DIP
Package Description WDIP, DIP40,.6
Pin Count 40
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T40
JESD-609 Code e0
Length 52.45 mm
Memory Density 1048576 bit
Memory IC Type UVPROM MODULE
Memory Width 16
Number of Functions 1
Number of Terminals 40
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64KX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.72 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AT27C1024L-20DM/883

This table gives cross-reference parts and alternative options found for AT27C1024L-20DM/883. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AT27C1024L-20DM/883, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C1024-200/BQA UVPROM, 64KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AT27C1024L-20DM/883 vs AM27C1024-200/BQA
AM27C1024-200DE UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion AT27C1024L-20DM/883 vs AM27C1024-200DE
NM27C210Q200 IC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM Texas Instruments AT27C1024L-20DM/883 vs NM27C210Q200
NM27C210QE200 IC 64K X 16 UVPROM, 200 ns, CDIP40, WINDOWED, CERAMIC, DIP-40, Programmable ROM National Semiconductor Corporation AT27C1024L-20DM/883 vs NM27C210QE200
AM27C1024-205DCB UVPROM, 64KX16, 200ns, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40 AMD AT27C1024L-20DM/883 vs AM27C1024-205DCB
TMS27C210-20JL 64KX16 UVPROM, 200ns, CDIP40, WINDOWED, CERDIP-40 Texas Instruments AT27C1024L-20DM/883 vs TMS27C210-20JL
AM27C1024-200DIB UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD AT27C1024L-20DM/883 vs AM27C1024-200DIB
AT27C1024-20DI UVPROM, 64KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation AT27C1024L-20DM/883 vs AT27C1024-20DI
AM27C1024-200DI UVPROM, 64KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD AT27C1024L-20DM/883 vs AM27C1024-200DI
AT27C1024L-20DI2 EPROM, 64KX16, 200ns, CMOS, CDIP40 Atmel Corporation AT27C1024L-20DM/883 vs AT27C1024L-20DI2
Part Number Description Manufacturer Compare
AT27HC1024-90KI UVPROM, 64KX16, 90ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 Atmel Corporation AT27C1024L-20DM/883 vs AT27HC1024-90KI
AM27C1024-125DI UVPROM, 64KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AT27C1024L-20DM/883 vs AM27C1024-125DI
NMC27C1024V170 64KX16 UVPROM, 170ns, PQCC44, PLASTIC, LCC-44 Texas Instruments AT27C1024L-20DM/883 vs NMC27C1024V170
AM27C1024-85LIB UVPROM, 64KX16, 85ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD AT27C1024L-20DM/883 vs AM27C1024-85LIB
TMS27C210A-250JE 64KX16 UVPROM, 250ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments AT27C1024L-20DM/883 vs TMS27C210A-250JE
AT27HC1024-90LM UVPROM, 64KX16, 90ns, CMOS, CQCC44, CERAMIC, LCC-44 Atmel Corporation AT27C1024L-20DM/883 vs AT27HC1024-90LM
M27C1024-70XF6 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AT27C1024L-20DM/883 vs M27C1024-70XF6
M27C1024-20XF6 64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AT27C1024L-20DM/883 vs M27C1024-20XF6
NM27LV210V300 IC 64K X 16 UVPROM, 300 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM National Semiconductor Corporation AT27C1024L-20DM/883 vs NM27LV210V300
NMC27C1024Q150 64KX16 UVPROM, 150ns, CDIP40, CERAMIC, DIP-40 Texas Instruments AT27C1024L-20DM/883 vs NMC27C1024Q150

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