Part Details for AM27LS01-1DC by AMD
Overview of AM27LS01-1DC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Renewable Energy
Automotive
Robotics and Drones
Part Details for AM27LS01-1DC
AM27LS01-1DC CAD Models
AM27LS01-1DC Part Data Attributes:
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AM27LS01-1DC
AMD
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Datasheet
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AM27LS01-1DC
AMD
Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 45 ns | |
JESD-30 Code | R-GDIP-T16 | |
JESD-609 Code | e0 | |
Length | 19.431 mm | |
Memory Density | 256 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 16 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 256X1 | |
Output Characteristics | OPEN-COLLECTOR | |
Output Enable | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for AM27LS01-1DC
This table gives cross-reference parts and alternative options found for AM27LS01-1DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS01-1DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27LS01/BEX | Standard SRAM, 256X1, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01/BEX |
AM27LS01APC | Standard SRAM, 256X1, 35ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01APC |
AM27LS01DCB | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01DCB |
AM27LS01PC | Standard SRAM, 256X1, 45ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01PC |
AM27LS01-1/BEA | Standard SRAM, 256X1, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01-1/BEA |
AM27LS01ADC | Standard SRAM, 256X1, 35ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01ADC |
AM27LS01-1DCB | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01-1DCB |
AM27LS01-1PC | Standard SRAM, 256X1, 45ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS01-1DC vs AM27LS01-1PC |