Part Details for AM27LS01ADC by AMD
Overview of AM27LS01ADC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Renewable Energy
Automotive
Robotics and Drones
Part Details for AM27LS01ADC
AM27LS01ADC CAD Models
AM27LS01ADC Part Data Attributes
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AM27LS01ADC
AMD
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Datasheet
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AM27LS01ADC
AMD
Standard SRAM, 256X1, 35ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19.431 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 256X1 | |
| Output Characteristics | OPEN-COLLECTOR | |
| Output Enable | NO | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class C | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | TTL | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27LS01ADC
This table gives cross-reference parts and alternative options found for AM27LS01ADC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS01ADC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27LS01-1PCB | Standard SRAM, 256X1, 45ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01-1PCB |
| AM27LS01ADCB | Standard SRAM, 256X1, 35ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01ADCB |
| AM27LS01-1DC | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01-1DC |
| AM27LS01/BEX | Standard SRAM, 256X1, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01/BEX |
| AM27LS01DCB | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01DCB |
| AM27LS01-1DCB | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01-1DCB |
| AM27LS01A/BEA | Standard SRAM, 256X1, 45ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | AM27LS01ADC vs AM27LS01A/BEA |