Datasheets
AM27C64-200DI by:

UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for AM27C64-200DI by Rochester Electronics LLC

Overview of AM27C64-200DI by Rochester Electronics LLC

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Applications Industrial Automation

Available Datasheets

Part # Manufacturer Description Datasheet
AM27C512-200DI Rochester Electronics LLC UVPROM,

Part Details for AM27C64-200DI

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AM27C64-200DI Part Data Attributes

AM27C64-200DI Rochester Electronics LLC
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AM27C64-200DI Rochester Electronics LLC UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Package Description WINDOWED, CERAMIC, DIP-28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-CDIP-T28
Memory Density 65536 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for AM27C64-200DI

This table gives cross-reference parts and alternative options found for AM27C64-200DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-200DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27C256R-90PA OTP ROM, 32KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Atmel Corporation AM27C64-200DI vs AT27C256R-90PA
CY27C256A-70JC OTP ROM, 32KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 Rochester Electronics LLC AM27C64-200DI vs CY27C256A-70JC
SST27SF512-70-3C-NHE 64K X 8 FLASH 12V PROM, 70 ns, PQCC32, LEAD FREE, PLASTIC, MO-016AE, LCC-32 Microchip Technology Inc AM27C64-200DI vs SST27SF512-70-3C-NHE
AM27C64-255DI UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Rochester Electronics LLC AM27C64-200DI vs AM27C64-255DI
5962-8751406XX EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Pyramid Semiconductor Corporation AM27C64-200DI vs 5962-8751406XX
WMF512K8-70DEI5 Flash, 512KX8, 70ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 Mercury Systems Inc AM27C64-200DI vs WMF512K8-70DEI5
5962-8751407YA EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation AM27C64-200DI vs 5962-8751407YA
AT27C256R-15TI OTP ROM, 32KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP-28 Atmel Corporation AM27C64-200DI vs AT27C256R-15TI
AM27C64-45DCB UVPROM, 8KX8, 45ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Rochester Electronics LLC AM27C64-200DI vs AM27C64-45DCB
AM27C64-200DEB UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Rochester Electronics LLC AM27C64-200DI vs AM27C64-200DEB

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