Part Details for AM27C64-200DI by Rochester Electronics LLC
Overview of AM27C64-200DI by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
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AM27C512-200DI | Rochester Electronics LLC | UVPROM, |
Part Details for AM27C64-200DI
AM27C64-200DI CAD Models
AM27C64-200DI Part Data Attributes
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AM27C64-200DI
Rochester Electronics LLC
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Datasheet
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AM27C64-200DI
Rochester Electronics LLC
UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Package Description | WINDOWED, CERAMIC, DIP-28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-CDIP-T28 | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |
Alternate Parts for AM27C64-200DI
This table gives cross-reference parts and alternative options found for AM27C64-200DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-200DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AT27C256R-90PA | OTP ROM, 32KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Atmel Corporation | AM27C64-200DI vs AT27C256R-90PA |
CY27C256A-70JC | OTP ROM, 32KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | AM27C64-200DI vs CY27C256A-70JC |
SST27SF512-70-3C-NHE | 64K X 8 FLASH 12V PROM, 70 ns, PQCC32, LEAD FREE, PLASTIC, MO-016AE, LCC-32 | Microchip Technology Inc | AM27C64-200DI vs SST27SF512-70-3C-NHE |
AM27C64-255DI | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C64-200DI vs AM27C64-255DI |
5962-8751406XX | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Pyramid Semiconductor Corporation | AM27C64-200DI vs 5962-8751406XX |
WMF512K8-70DEI5 | Flash, 512KX8, 70ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Mercury Systems Inc | AM27C64-200DI vs WMF512K8-70DEI5 |
5962-8751407YA | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | AM27C64-200DI vs 5962-8751407YA |
AT27C256R-15TI | OTP ROM, 32KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP-28 | Atmel Corporation | AM27C64-200DI vs AT27C256R-15TI |
AM27C64-45DCB | UVPROM, 8KX8, 45ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C64-200DI vs AM27C64-45DCB |
AM27C64-200DEB | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C64-200DI vs AM27C64-200DEB |