AM27C64-200DI
vs
CY27C256A-70JC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Contact Manufacturer
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ROCHESTER ELECTRONICS LLC
Package Description
WINDOWED, CERAMIC, DIP-28
PLASTIC, LCC-32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
200 ns
70 ns
JESD-30 Code
R-CDIP-T28
R-PQCC-J32
Memory Density
65536 bit
262144 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
8192 words
32768 words
Number of Words Code
8000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
J BEND
Terminal Position
DUAL
QUAD
Base Number Matches
2
1
Compare AM27C64-200DI with alternatives
Compare CY27C256A-70JC with alternatives