Part Details for AT27C256R-90PA by Atmel Corporation
Overview of AT27C256R-90PA by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HM2R90PA8100N9LF | Amphenol Communications Solutions | Back Plane Connectors, 2mm Hard Metric Series, Millipacs, Right Angle Receptacle,Type FR without Pegs ,Press Fit Tail,200 Signal Pin, 250 mating cycles and ROHS Compliant |
Part Details for AT27C256R-90PA
AT27C256R-90PA CAD Models
AT27C256R-90PA Part Data Attributes
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AT27C256R-90PA
Atmel Corporation
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Datasheet
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AT27C256R-90PA
Atmel Corporation
OTP ROM, 32KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, PLASTIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 90 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 36.95 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 13 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.59 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AT27C256R-90PA
This table gives cross-reference parts and alternative options found for AT27C256R-90PA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AT27C256R-90PA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C256A-70JC | OTP ROM, 32KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | AT27C256R-90PA vs CY27C256A-70JC |
| AT27C256R-55PI | OTP ROM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Atmel Corporation | AT27C256R-90PA vs AT27C256R-55PI |
| WMF512K8-70CLQ5 | Flash, 512KX8, 70ns, CQCC32, CERAMIC, LCC-32 | Mercury Systems Inc | AT27C256R-90PA vs WMF512K8-70CLQ5 |
| AM27C64-200DEB | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AT27C256R-90PA vs AM27C64-200DEB |
| 5962-8751406XX | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Pyramid Semiconductor Corporation | AT27C256R-90PA vs 5962-8751406XX |
| AM27C64-250DC | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | AT27C256R-90PA vs AM27C64-250DC |
| CY27C010-70WC | UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | Rochester Electronics LLC | AT27C256R-90PA vs CY27C010-70WC |
| AT27LV010-25KC | UVPROM, 128KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | Atmel Corporation | AT27C256R-90PA vs AT27LV010-25KC |
| AT27C256R-90TI | OTP ROM, 32KX8, 90ns, CMOS, PDSO28, PLASTIC, TSOP-28 | Atmel Corporation | AT27C256R-90PA vs AT27C256R-90TI |
| 5962-8751413XA | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Pyramid Semiconductor Corporation | AT27C256R-90PA vs 5962-8751413XA |