Part Details for AM27C64-200DC by Spansion
Overview of AM27C64-200DC by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for AM27C64-200DC
AM27C64-200DC CAD Models
AM27C64-200DC Part Data Attributes:
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AM27C64-200DC
Spansion
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Datasheet
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AM27C64-200DC
Spansion
UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP28,.6 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CDIP-T28 | |
JESD-609 Code | e0 | |
Length | 37.147 mm | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.75 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C64-200DC
This table gives cross-reference parts and alternative options found for AM27C64-200DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-200DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
8200507YA | UVPROM, 8KX8, 200ns, CMOS, CDIP28 | LSI Corporation | AM27C64-200DC vs 8200507YA |
DE2764-20 | UVPROM, 8KX8, 200ns, NMOS, CDIP28 | LSI Corporation | AM27C64-200DC vs DE2764-20 |
CY27C64-200WC | UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C64-200DC vs CY27C64-200WC |
CY27C64-200WI | UVPROM, 8KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C64-200DC vs CY27C64-200WI |
27C64A/BXA-20 | UVPROM, 8KX8, 200ns, CMOS, CDIP28 | YAGEO Corporation | AM27C64-200DC vs 27C64A/BXA-20 |
8510203YX | UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Waferscale Integration Inc | AM27C64-200DC vs 8510203YX |
8510203YX | UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | AM27C64-200DC vs 8510203YX |
8510203YX | UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | AM27C64-200DC vs 8510203YX |
8510203YA | UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | AM27C64-200DC vs 8510203YA |
DQ2764-20 | UVPROM, 8KX8, 200ns, MOS, CDIP28 | LSI Corporation | AM27C64-200DC vs DQ2764-20 |