Part Details for 8411102YX by AMD
Overview of 8411102YX by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Part Details for 8411102YX
8411102YX CAD Models
8411102YX Part Data Attributes
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8411102YX
AMD
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8411102YX
AMD
UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 8411102YX
This table gives cross-reference parts and alternative options found for 8411102YX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 8411102YX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 27C256MQ7B/Y25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 8411102YX vs 27C256MQ7B/Y25 |
| DM27C256-25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28 | LSI Corporation | 8411102YX vs DM27C256-25 |
| 8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 8411102YX vs 8411102YX |
| 5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 8411102YX vs 5962-8606312XA |
| 27C256MQ25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 8411102YX vs 27C256MQ25 |
| 5962-8606302XX | 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | 8411102YX vs 5962-8606302XX |
| 5962-8606312QXX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | 8411102YX vs 5962-8606312QXX |
| 27C256MQB/C25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 8411102YX vs 27C256MQB/C25 |
| 5962-8606302XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 8411102YX vs 5962-8606302XX |
| M38510/22401BYX | UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | 8411102YX vs M38510/22401BYX |