|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
|
Part Package Code
|
CERDIP
|
|
Package Description
|
CERAMIC, DIP-24
|
|
Pin Count
|
24
|
|
Manufacturer Package Code
|
F24.6
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.41
|
|
Samacsys Manufacturer
|
Renesas Electronics
|
|
Access Time-Max
|
70 ns
|
|
JESD-30 Code
|
R-GDIP-T24
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
16384 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
24
|
|
Number of Words
|
2048 words
|
|
Number of Words Code
|
2000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
2KX8
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
DIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
MIL-STD-883
|
|
Seated Height-Max
|
5.72 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HM3-65162-5:D | Standard SRAM, 2KX8, 70ns, CMOS, PDIP24 | Matra MHS | 8403606JA vs HM3-65162-5:D |
| AM9128-70DEB | Standard SRAM, 2KX8, 70ns, NMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | AMD | 8403606JA vs AM9128-70DEB |
| 8403606JX | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24 | Renesas Electronics Corporation | 8403606JA vs 8403606JX |
| AM9128-70PC | Standard SRAM, 2KX8, 70ns, CMOS, PDIP24, PLASTIC, DIP-24 | Force Technologies Ltd | 8403606JA vs AM9128-70PC |
| HM3-65162C-5 | Standard SRAM, 2KX8, 70ns, CMOS, PDIP24, | Temic Semiconductors | 8403606JA vs HM3-65162C-5 |
| IDT6116LA70DGB | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | 8403606JA vs IDT6116LA70DGB |
| JM38510/29110BJA | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24 | Harris Semiconductor | 8403606JA vs JM38510/29110BJA |
| 8403606ZA | 2KX8 STANDARD SRAM, 70ns, CQCC32, CERAMIC, CC-32 | Intersil Corporation | 8403606JA vs 8403606ZA |
| 8403606JX | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 | Harris Semiconductor | 8403606JA vs 8403606JX |
| IDT6116SA70DGB | Standard SRAM, 2KX8, 70ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | Integrated Device Technology Inc | 8403606JA vs IDT6116SA70DGB |