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Memory SRAMs 5962H3829436BXX

Memory
5962H3829436BXX
Description: Standard SRAM, 8KX8, 75ns, CMOS, CDIP28, 0.600 X 1.200 INCH, 0.100 INCH PITCH, CERAMIC, DIP-28

Overview of 5962H3829436BXX by Cobham Semiconductor Solutions

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Where used in Applications: Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

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Part Data Attributes for 5962H3829436BXX by Cobham Semiconductor Solutions
Parametric Data

5962H3829436BXX
Cobham Semiconductor Solutions
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-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.1.A
HTS Code
8542.32.00.41
Access Time-Max
75 ns
JESD-30 Code
R-GDIP-T28
Length
35.56 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
4.445 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Total Dose
1M Rad(Si) V
Width
15.24 mm
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  1. 5962H3829436BXX
    Cobham Semiconductor Solutions
    Standard SRAM, 8KX8, 75ns, CMOS, CDIP28, 0.600 X 1.200 INCH, 0.100 INCH PITCH, CERAMIC, DIP-28
    VS

Alternate Parts for 5962H3829436BXX

This table gives cross-reference parts and alternative options found for 5962H3829436BXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962H3829436BXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
P4C164-70DWMBLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation 5962H3829436BXX vs P4C164-70DWMBLF
FT6264-70DWM Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd 5962H3829436BXX vs FT6264-70DWM
5962R3829436BXC Standard SRAM, 8KX8, 75ns, CMOS, CDIP28, 0.600 X 1.200 INCH, 0.100 INCH PITCH, CERAMIC, DIP-28 Cobham Semiconductor Solutions 5962H3829436BXX vs 5962R3829436BXC
P4C164L-70CWM Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation 5962H3829436BXX vs P4C164L-70CWM
5962-8552504XX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28 Motorola Semiconductor Products 5962H3829436BXX vs 5962-8552504XX
P4C164-70DWILF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.600 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 Pyramid Semiconductor Corporation 5962H3829436BXX vs P4C164-70DWILF
7164S70TCB Standard SRAM, 8KX8, 70ns, CMOS, CDIP28 Integrated Device Technology Inc 5962H3829436BXX vs 7164S70TCB
5962-8552504XX Standard SRAM, 8KX8, 70ns, CMOS, CDIP28 Intel Corporation 5962H3829436BXX vs 5962-8552504XX
P4C164L-70L32MLF Standard SRAM, 8KX8, 70ns, CMOS, CQCC32, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32 Pyramid Semiconductor Corporation 5962H3829436BXX vs P4C164L-70L32MLF
P4C164-70CMLF Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, SIDE BRAZED, DIP-28 Pyramid Semiconductor Corporation 5962H3829436BXX vs P4C164-70CMLF
Part Number Description Manufacturer Compare
WS128K32-45HSME SRAM Module, 512KX8, 45ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp 5962H3829436BXX vs WS128K32-45HSME
CY7C194-35LC Standard SRAM, 64KX4, 35ns, CMOS, LCC-28 Cypress Semiconductor 5962H3829436BXX vs CY7C194-35LC
SMDP-65656L45 Standard SRAM, 32KX8, CMOS, CDFP28, Temic Semiconductors 5962H3829436BXX vs SMDP-65656L45
FT6264-45PCLF Standard SRAM, 8KX8, 45ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 Force Technologies Ltd 5962H3829436BXX vs FT6264-45PCLF
FT6198A-20DC Standard SRAM, 16KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Force Technologies Ltd 5962H3829436BXX vs FT6198A-20DC
WS128K32V-20G4S SRAM Module, 512KX8, 20ns, CMOS, White Electronic Designs Corp 5962H3829436BXX vs WS128K32V-20G4S
WS128K32-20G4I SRAM Module, 512KX8, 20ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962H3829436BXX vs WS128K32-20G4I
MB8287-35PSK Standard SRAM, 32KX8, 35ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 FUJITSU Semiconductor Limited 5962H3829436BXX vs MB8287-35PSK
WS128K32-45G2IA SRAM Module, 512KX8, 45ns, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp 5962H3829436BXX vs WS128K32-45G2IA
IMS1820W-35 64KX4 STANDARD SRAM, 35ns, CQCC28, CERAMIC, LCC-28 STMicroelectronics 5962H3829436BXX vs IMS1820W-35

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