5962-9561312HYA by:

Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32

Part Details for 5962-9561312HYA by Microsemi Corporation

Overview of 5962-9561312HYA by Microsemi Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

Part Details for 5962-9561312HYA

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5962-9561312HYA Part Data Attributes

5962-9561312HYA Microsemi Corporation
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5962-9561312HYA Microsemi Corporation Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32
Pbfree Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 35 ns
JESD-30 Code R-CDIP-T32
JESD-609 Code e0
Length 42.2 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-PRF-38534 Class H
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for 5962-9561312HYA

This table gives cross-reference parts and alternative options found for 5962-9561312HYA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9561312HYA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-9561312HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs 5962-9561312HYC
5962-9560002MXX Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs 5962-9560002MXX
5962-9561307HYC Cache SRAM, 512KX8, 35ns, CMOS, CDIP32, DIP, CERAMIC-32 Microsemi Corporation 5962-9561312HYA vs 5962-9561307HYC
WMS512K8-35CIA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8-35CIA
WMS512K8-35CQ Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8-35CQ
WMS512K8-35CI Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8-35CI
5962-9561312HYX Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs 5962-9561312HYX
5962-9560002MXA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs 5962-9560002MXA
ACT-S512K8N-035P4Q Cache SRAM, 512KX8, 35ns, CMOS, CDIP32, 1.600 X 0.600 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, DIP-32 Cobham Power Products 5962-9561312HYA vs ACT-S512K8N-035P4Q
Part Number Description Manufacturer Compare
5962-9560008MUA Standard SRAM, 512KX8, 20ns, CMOS, SOJ-32 Microsemi Corporation 5962-9561312HYA vs 5962-9560008MUA
5962-9561315HYX Standard SRAM, 512KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs 5962-9561315HYX
WMS512K8L-45CM Standard SRAM, 512KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8L-45CM
WMS512K8-L45CLC 512KX8 STANDARD SRAM, 45ns, CQCC32, BRAZED, CERAMIC, QCC-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8-L45CLC
WMS512K8-55CLC Standard SRAM, 512KX8, 55ns, CMOS, CQCC32, BRAZED, CERAMIC, LCC-32 Microsemi Corporation 5962-9561312HYA vs WMS512K8-55CLC
5962D9960601TUX Standard SRAM, 512KX8, 100ns, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, DFP-32 Cobham Semiconductor Solutions 5962-9561312HYA vs 5962D9960601TUX
UT7Q512-100UPX Standard SRAM, 512KX8, 100ns, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, DFP-32 Cobham Semiconductor Solutions 5962-9561312HYA vs UT7Q512-100UPX
R1LV0408DSB-7LI 512KX8 STANDARD SRAM, 70ns, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 Renesas Electronics Corporation 5962-9561312HYA vs R1LV0408DSB-7LI
EDI88512C85CM Standard SRAM, 512KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs EDI88512C85CM
WS512K8-55CMEA SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation 5962-9561312HYA vs WS512K8-55CMEA

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