Part Details for 5962-8961403XA by Intel Corporation
Overview of 5962-8961403XA by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Renewable Energy
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-8961403XA
5962-8961403XA CAD Models
5962-8961403XA Part Data Attributes
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5962-8961403XA
Intel Corporation
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5962-8961403XA
Intel Corporation
UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-GDIP-T32 | |
| JESD-609 Code | e0 | |
| Length | 42.1005 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-8961403XA
This table gives cross-reference parts and alternative options found for 5962-8961403XA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-8961403XA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPV27C101-200C | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | B&B Electronics Manufacturing Company | 5962-8961403XA vs DPV27C101-200C |
| AM27C010-200DCB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | 5962-8961403XA vs AM27C010-200DCB |
| M27C1001-20F1L | 128KX8 UVPROM, 200ns, CDIP32, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 | STMicroelectronics | 5962-8961403XA vs M27C1001-20F1L |
| AT27CL010-20DM/883 | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | 5962-8961403XA vs AT27CL010-20DM/883 |
| 5962-8961403XX | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | Waferscale Integration Inc | 5962-8961403XA vs 5962-8961403XX |
| MBM27C1000-20Z | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | FUJITSU Semiconductor Limited | 5962-8961403XA vs MBM27C1000-20Z |
| M27C1001-20F1 | 128KX8 UVPROM, 200ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | STMicroelectronics | 5962-8961403XA vs M27C1001-20F1 |
| 5962-8961403XA | UVPROM, 128KX8, 200ns, CMOS, CDIP32 | QP Semiconductor | 5962-8961403XA vs 5962-8961403XA |
| AM27C010-200DE | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | 5962-8961403XA vs AM27C010-200DE |
| NM27C010QE200 | 128KX8 UVPROM, 200ns, CDIP32, WINDOWED, CERAMIC, DIP-32 | Texas Instruments | 5962-8961403XA vs NM27C010QE200 |