Part Details for 5662-860632YA by Teledyne e2v
Overview of 5662-860632YA by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AD5662BRJZ-2REEL7 | Analog Devices | Single 16bit SPI DAC reset to | |
| AD5662BRMZ-1 | Analog Devices | Single 2.7-5.5V 16bit SPI DAC | |
| AD5662ARJZ-1500RL7 | Analog Devices | Single 2.7-5.5V 16bit SPI DAC |
Part Details for 5662-860632YA
5662-860632YA CAD Models
5662-860632YA Part Data Attributes
|
|
5662-860632YA
Teledyne e2v
Buy Now
Datasheet
|
Compare Parts:
5662-860632YA
Teledyne e2v
UVPROM, 32KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 Class B | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 5662-860632YA
This table gives cross-reference parts and alternative options found for 5662-860632YA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5662-860632YA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 27C256MQ7B/Y25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 5662-860632YA vs 27C256MQ7B/Y25 |
| DM27C256-25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28 | LSI Corporation | 5662-860632YA vs DM27C256-25 |
| 8411102YX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 5662-860632YA vs 8411102YX |
| 5962-8606312XA | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5662-860632YA vs 5962-8606312XA |
| 27C256MQ25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | 5662-860632YA vs 27C256MQ25 |
| 5962-8606302XX | 32KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | 5662-860632YA vs 5962-8606302XX |
| 5962-8606312QXX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Cypress Semiconductor | 5662-860632YA vs 5962-8606312QXX |
| 27C256MQB/C25 | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 5662-860632YA vs 27C256MQB/C25 |
| 5962-8606302XX | UVPROM, 32KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Intel Corporation | 5662-860632YA vs 5962-8606302XX |
| M38510/22401BYX | UVPROM, 32KX8, 250ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | 5662-860632YA vs M38510/22401BYX |