There are no models available for this part yet.
Overview of 27C64MQ25 by Teledyne e2v
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
CAD Models for 27C64MQ25 by Teledyne e2v
Part Data Attributes for 27C64MQ25 by Teledyne e2v
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ATMEL GRENOBLE
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|
Part Package Code
|
DIP
|
|
Package Description
|
,
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
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|
HTS Code
|
8542.32.00.61
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|
Access Time-Max
|
250 ns
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|
JESD-30 Code
|
R-GDIP-T28
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Memory Density
|
65536 bit
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Memory IC Type
|
UVPROM
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Memory Width
|
8
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Number of Functions
|
1
|
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Number of Terminals
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28
|
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Number of Words
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8192 words
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Number of Words Code
|
8000
|
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Operating Mode
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ASYNCHRONOUS
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|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
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Organization
|
8KX8
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Supply Current-Max
|
0.03 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
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|
Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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|
Technology
|
CMOS
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Temperature Grade
|
MILITARY
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Terminal Form
|
THROUGH-HOLE
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Terminal Position
|
DUAL
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Alternate Parts for 27C64MQ25
This table gives cross-reference parts and alternative options found for 27C64MQ25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C64MQ25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C64-255DCB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Spansion | 27C64MQ25 vs AM27C64-255DCB |
| AM27C64-255DE | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ25 vs AM27C64-255DE |
| AM27C64-250DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | 27C64MQ25 vs AM27C64-250DIB |
| LD2764-25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | 27C64MQ25 vs LD2764-25 |
| NMC27C64QM250 | IC 8K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | 27C64MQ25 vs NMC27C64QM250 |
| MBM27C64-25-XZ | 8KX8 UVPROM, 250ns, CDIP28, CERDIP-28 | FUJITSU Limited | 27C64MQ25 vs MBM27C64-25-XZ |
| 27C64A/BXA-25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28 | YAGEO Corporation | 27C64MQ25 vs 27C64A/BXA-25 |
| TMS27C64JE4 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27C64MQ25 vs TMS27C64JE4 |
| TMS27C64JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | 27C64MQ25 vs TMS27C64JE |
| NTE2764 | UVPROM, 8KX8, 250ns, NMOS, DIP-28 | NTE Electronics Inc | 27C64MQ25 vs NTE2764 |