Part Details for 27C040-200V10 by Intel Corporation
Overview of 27C040-200V10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Part Details for 27C040-200V10
27C040-200V10 CAD Models
27C040-200V10 Part Data Attributes
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27C040-200V10
Intel Corporation
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Datasheet
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27C040-200V10
Intel Corporation
UVPROM, 512KX8, 200ns, CMOS, CDIP32, DIP-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
JESD-30 Code | R-GDIP-T32 | |
Length | 42.165 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.72 mm | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for 27C040-200V10
This table gives cross-reference parts and alternative options found for 27C040-200V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C040-200V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AT27LV040-20DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | 27C040-200V10 vs AT27LV040-20DC |
AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | 27C040-200V10 vs AM27C040-200DC |
AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | 27C040-200V10 vs AM27C040-200DC |
M27C4001-20XF1 | 512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | STMicroelectronics | 27C040-200V10 vs M27C4001-20XF1 |
TC574000D-20 | IC 512K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM | Toshiba America Electronic Components | 27C040-200V10 vs TC574000D-20 |
5962-9175202MXX | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Intel Corporation | 27C040-200V10 vs 5962-9175202MXX |
5962-9175202MXA | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | QP Semiconductor | 27C040-200V10 vs 5962-9175202MXA |
AM27C040-200DIB | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | 27C040-200V10 vs AM27C040-200DIB |
AM27C040-200DEB | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | 27C040-200V10 vs AM27C040-200DEB |
AM27C040-200DE | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | 27C040-200V10 vs AM27C040-200DE |