Part Details for M27C4001-20F1 by STMicroelectronics
Overview of M27C4001-20F1 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DFE322520F-1R0M=P2 | Murata Manufacturing Co Ltd | Fixed IND 1uH 6700mA NONAUTO | |
DFE322520F-1R5M=P2 | Murata Manufacturing Co Ltd | Fixed IND 1.5uH 5200mA NONAUTO | |
7334L2620F13LF | Amphenol Communications Solutions | Smart Card Reader, Input Output Connectors, Connectors for Friendly Environment, 8 contacts, Raised, Underneath clearance 6.4 mm, Low cycle, Lead Free. |
Part Details for M27C4001-20F1
M27C4001-20F1 CAD Models
M27C4001-20F1 Part Data Attributes
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M27C4001-20F1
STMicroelectronics
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Datasheet
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M27C4001-20F1
STMicroelectronics
512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | |
Pin Count | 32 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T32 | |
JESD-609 Code | e0 | |
Memory Density | 4194304 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.71 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C4001-20F1
This table gives cross-reference parts and alternative options found for M27C4001-20F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C4001-20F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AT27LV040-20DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | M27C4001-20F1 vs AT27LV040-20DC |
AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | M27C4001-20F1 vs AM27C040-200DC |
AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | M27C4001-20F1 vs AM27C040-200DC |
M27C4001-20XF1 | 512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | STMicroelectronics | M27C4001-20F1 vs M27C4001-20XF1 |
TC574000D-20 | IC 512K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM | Toshiba America Electronic Components | M27C4001-20F1 vs TC574000D-20 |
5962-9175202MXX | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Intel Corporation | M27C4001-20F1 vs 5962-9175202MXX |
5962-9175202MXA | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | QP Semiconductor | M27C4001-20F1 vs 5962-9175202MXA |
AM27C040-200DIB | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | M27C4001-20F1 vs AM27C040-200DIB |
AM27C040-200DEB | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | M27C4001-20F1 vs AM27C040-200DEB |
AM27C040-200DE | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | M27C4001-20F1 vs AM27C040-200DE |