Part Details for AM27C040-200DIB by Spansion
Overview of AM27C040-200DIB by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for AM27C040-200DIB
AM27C040-200DIB CAD Models
AM27C040-200DIB Part Data Attributes
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AM27C040-200DIB
Spansion
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Datasheet
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AM27C040-200DIB
Spansion
UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 42.1 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C040-200DIB
This table gives cross-reference parts and alternative options found for AM27C040-200DIB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C040-200DIB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AT27LV040-20DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | AM27C040-200DIB vs AT27LV040-20DC |
| AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | AM27C040-200DIB vs AM27C040-200DC |
| AM27C040-200DC | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27C040-200DIB vs AM27C040-200DC |
| M27C4001-20XF1 | 512KX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | STMicroelectronics | AM27C040-200DIB vs M27C4001-20XF1 |
| TC574000D-20 | IC 512K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM | Toshiba America Electronic Components | AM27C040-200DIB vs TC574000D-20 |
| 5962-9175202MXX | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Intel Corporation | AM27C040-200DIB vs 5962-9175202MXX |
| 5962-9175202MXA | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | QP Semiconductor | AM27C040-200DIB vs 5962-9175202MXA |
| AM27C040-200DEB | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | AM27C040-200DIB vs AM27C040-200DEB |
| AM27C040-200DE | UVPROM, 512KX8, 200ns, CMOS, CDIP32, CERAMIC,DIP-32 | Spansion | AM27C040-200DIB vs AM27C040-200DE |
| 5962-9175202MXA | UVPROM, 512KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | AM27C040-200DIB vs 5962-9175202MXA |