Part Details for 2114L-3DCQM by Fairchild Semiconductor Corporation
Overview of 2114L-3DCQM by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
76745-321-14LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch. | |
89006-2114LF | Amphenol Communications Solutions | 5 Row Signal Header, Straight, Press-Fit, Wide body | |
89007-2114LF | Amphenol Communications Solutions | Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 2 Mod, Press Fit. |
Part Details for 2114L-3DCQM
2114L-3DCQM CAD Models
2114L-3DCQM Part Data Attributes
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2114L-3DCQM
Fairchild Semiconductor Corporation
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Datasheet
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2114L-3DCQM
Fairchild Semiconductor Corporation
Standard SRAM, 1KX4, 300ns, MOS, CDIP18,
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Package Description | DIP, DIP18,.3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 300 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-XDIP-T18 | |
JESD-609 Code | e0 | |
Memory Density | 4096 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 4 | |
Moisture Sensitivity Level | 2A | |
Number of Terminals | 18 | |
Number of Words | 1024 words | |
Number of Words Code | 1000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1KX4 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP18,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for 2114L-3DCQM
This table gives cross-reference parts and alternative options found for 2114L-3DCQM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 2114L-3DCQM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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F2114L-3DCQM | Standard SRAM, 1KX4, 300ns, MOS, CDIP18, | Fairchild Semiconductor Corporation | 2114L-3DCQM vs F2114L-3DCQM |
F2114-3DC | Standard SRAM, 1KX4, 300ns, MOS, CDIP18, | Fairchild Semiconductor Corporation | 2114L-3DCQM vs F2114-3DC |
2114-3DCQM | Standard SRAM, 1KX4, 300ns, MOS, CDIP18, | Fairchild Semiconductor Corporation | 2114L-3DCQM vs 2114-3DCQM |
F2114-3DCQM | Standard SRAM, 1KX4, 300ns, MOS, CDIP18, | Fairchild Semiconductor Corporation | 2114L-3DCQM vs F2114-3DCQM |
AM91L14CDC | Standard SRAM, 1KX4, 300ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | 2114L-3DCQM vs AM91L14CDC |
AM9114CDC | Standard SRAM, 1KX4, 300ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | 2114L-3DCQM vs AM9114CDC |