ZL50019GAG2
vs
ZL50018QCG1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256
28 X 28 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BJC, LQFP-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PQFP-G256
JESD-609 Code
e1
e3
Length
17 mm
28 mm
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
1.6 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Matte Tin (Sn)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.4 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
28 mm
Base Number Matches
3
3
Rohs Code
Package Equivalence Code
QFP256,1.2SQ,16
Supply Current-Max
165 mA
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