ZL50018QCG1 vs ZL50023QCC feature comparison

ZL50018QCG1 Microchip Technology Inc

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ZL50023QCC Zarlink Semiconductor Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ZARLINK SEMICONDUCTOR INC
Package Description 28 X 28 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BJC, LQFP-256 LFQFP, QFP256,1.2SQ,16
Reach Compliance Code compliant compliant
JESD-30 Code S-PQFP-G256 S-PQFP-G256
JESD-609 Code e3 e0
Length 28 mm 28 mm
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP256,1.2SQ,16 QFP256,1.2SQ,16
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Current-Max 165 mA
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.4 mm 0.4 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 3 3
HTS Code 8542.39.00.01
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Technology CMOS

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