ZL50018GAG2 vs ZL50060GAG2 feature comparison

ZL50018GAG2 Zarlink Semiconductor Inc

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ZL50060GAG2 Microsemi Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Package Description 17 X 17 MM, 1.61 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, BGA-256 17 X 17 MM, 1.61 MM HEIGHT, MS-034, LEAD FREE, BGA-256
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Number of Functions 1 1
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 3 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 256

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