XR16V554IJ vs SC16C554DBIB64,151 feature comparison

XR16V554IJ Exar Corporation

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SC16C554DBIB64,151 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer EXAR CORP NXP SEMICONDUCTORS
Part Package Code LCC QFP
Package Description PLASTIC, LCC-68 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
Pin Count 68 64
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 64 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT; SYNC, BYTE; EXT SYNC
Data Transfer Rate-Max 0.5 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQFP-G64
Length 24.23 mm 10 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1 1
Number of Serial I/Os 4 4
Number of Terminals 68 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC68,1.0SQ QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.6 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Width 24.23 mm 10 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 3 1
Manufacturer Package Code SOT314-2
Samacsys Manufacturer NXP
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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