SC16C554DBIB64,151
vs
ST16C554DIJ68-F
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
EXAR CORP
Part Package Code
QFP
LCC
Package Description
10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
GREEN, PLASTIC, LCC-68
Pin Count
64
68
Manufacturer Package Code
SOT314-2
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
EXAR
Additional Feature
ALSO OPERATES AT 2.5V AND 5V SUPPLY
ALSO OPERATES AT 2.97 V MINIMUM SUPPLY
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
80 MHz
24 MHz
Communication Protocol
ASYNC, BIT; SYNC, BYTE; EXT SYNC
ASYNC, BIT
Data Transfer Rate-Max
0.625 MBps
0.1875 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G64
S-PQCC-J68
JESD-609 Code
e3
e3
Length
10 mm
24.23 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
1
1
Number of Serial I/Os
4
4
Number of Terminals
64
68
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QCCJ
Package Equivalence Code
QFP64,.47SQ,20
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
5.08 mm
Supply Voltage-Max
3.63 V
5.5 V
Supply Voltage-Min
2.97 V
4.5 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
24.23 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
2
Pbfree Code
Yes
Data Encoding/Decoding Method
NRZ
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