Findchips: Compare XQ5VFX100T-1EF1136M vs XC5VFX100T-2FFG1136C

XQ5VFX100T-1EF1136M vs XC5VFX100T-2FFG1136C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	FCBGA-1136	BGA-1136
Pin Count	1136	1136
Reach Compliance Code	not_compliant	compliant
ECCN Code	3A001.A.2.C	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	1098 MHz
Combinatorial Delay of a CLB-Max	0.9 ns	0.77 ns
JESD-30 Code	S-PBGA-B1136	S-PBGA-B1136
JESD-609 Code	e0	e1
Length	35 mm	35 mm
Number of CLBs	8960	8000
Number of Inputs	640	640
Number of Logic Cells	102400	102400
Number of Outputs	640	640
Number of Terminals	1136	1136
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1136,34X34,40	BGA1136,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.4 mm	3.25 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	OTHER
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	2	2
Moisture Sensitivity Level		4
Organization		8000 CLBS
Peak Reflow Temperature (Cel)		245
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays