XQ5VFX100T-1EF1136M vs XC5VFX100T-1FFG1136I feature comparison

XQ5VFX100T-1EF1136M AMD Xilinx

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XC5VFX100T-1FFG1136I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FCBGA-1136 BGA-1136
Pin Count 1136 1136
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.2.C 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of CLBs 8960 8000
Number of Inputs 640 640
Number of Logic Cells 102400 102400
Number of Outputs 640 640
Number of Terminals 1136 1136
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 2 2
Moisture Sensitivity Level 4
Organization 8000 CLBS
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC5VFX100T-1FFG1136I with alternatives