XPC860PZP66D4R2 vs TSXPC860SRMZPU66D4 feature comparison

XPC860PZP66D4R2 Freescale Semiconductor

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TSXPC860SRMZPU66D4 Atmel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 2.05 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

Compare XPC860PZP66D4R2 with alternatives

Compare TSXPC860SRMZPU66D4 with alternatives