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XPC860PZP66D4R2 vs XPC860DPZP66D4 feature comparison

XPC860PZP66D4R2 Motorola Mobility LLC

Buy Now Datasheet

XPC860DPZP66D4 Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code BGA BGA
Package Description BGA, BGA, BGA357,19X19,50
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Length 25 mm 25 mm
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 2.05 mm
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type SoC SoC
Base Number Matches 3 3
Operating Temperature-Min
Package Equivalence Code BGA357,19X19,50
Microcontrollers and Processors » Microprocessors
Microcontrollers and Processors » Microprocessors

Compare XPC860PZP66D4R2 with alternatives

Compare XPC860DPZP66D4 with alternatives