Findchips: Compare TSXPC860SRMZPU66D4 vs XPC860PCZP66D4

TSXPC860SRMZPU66D4 vs XPC860PCZP66D4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	MOTOROLA INC
Part Package Code	BGA	BGA
Package Description	BGA,	BGA, BGA357,19X19,50
Pin Count	357	357
Reach Compliance Code	compliant	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32
Bit Size	32
Boundary Scan	YES
Clock Frequency-Max	66 MHz
External Data Bus Width	32
Format	FIXED POINT
Integrated Cache	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
Length	25 mm	25 mm
Low Power Mode	YES
Number of Terminals	357	357
Operating Temperature-Max	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.05 mm	2.05 mm
Speed	66 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	SoC
Base Number Matches	2	3
Package Equivalence Code		BGA357,19X19,50
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors