XPC8240LZU200C
vs
PC8240MTPU250C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
TELEDYNE E2V (UK) LTD
Reach Compliance Code
unknown
compliant
Bit Size
32
32
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Number of Terminals
352
352
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Power Supplies
2.5,3.3 V
Qualification Status
Not Qualified
Not Qualified
Speed
200 MHz
250 MHz
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Part Package Code
BGA
Package Description
LBGA,
Pin Count
352
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
Length
35 mm
Low Power Mode
YES
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Seated Height-Max
1.65 mm
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.5 V
Temperature Grade
MILITARY
Width
35 mm
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