PC8240MTPU250C
vs
XPC8240LZU200B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
MOTOROLA INC
Part Package Code
BGA
Package Description
LBGA,
LBGA, BGA352,26X26,50
Pin Count
352
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
Length
35 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
352
352
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
1.65 mm
Speed
250 MHz
200 MHz
Supply Voltage-Max
2.75 V
2.625 V
Supply Voltage-Min
2.5 V
2.375 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Package Equivalence Code
BGA352,26X26,50
Supply Voltage-Nom
2.5 V
Compare PC8240MTPU250C with alternatives
Compare XPC8240LZU200B with alternatives