XCVU095-1FFVC2104I vs XCVU095-1FFVB1760C feature comparison

XCVU095-1FFVC2104I AMD Xilinx

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XCVU095-1FFVB1760C AMD

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Package Description BGA-2104 FBGA-1760
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B2104 S-PBGA-B1760
JESD-609 Code e1 e1
Length 47.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 768 67200
Number of Inputs 832 832
Number of Logic Cells 1176000 1176000
Number of Outputs 832 832
Number of Terminals 2104 1760
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 768 CLBS 67200 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA2104,46X46,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.04 mm 3.71 mm
Supply Voltage-Max 0.979 V 0.979 V
Supply Voltage-Min 0.922 V 0.922 V
Supply Voltage-Nom 0.95 V 0.95 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 47.5 mm 42.5 mm
Base Number Matches 2 2

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