Part Details for XCVU095-1FFVB1760C by AMD
Overview of XCVU095-1FFVB1760C by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for XCVU095-1FFVB1760C
XCVU095-1FFVB1760C CAD Models
XCVU095-1FFVB1760C Part Data Attributes
|
|
XCVU095-1FFVB1760C
AMD
Buy Now
Datasheet
|
Compare Parts:
XCVU095-1FFVB1760C
AMD
Field Programmable Gate Array, 1176000-Cell, PBGA1760, FBGA-1760
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-1760 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 67200 | |
| Number of Inputs | 832 | |
| Number of Logic Cells | 1176000 | |
| Number of Outputs | 832 | |
| Number of Terminals | 1760 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 67200 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.71 mm | |
| Supply Voltage-Max | 0.979 V | |
| Supply Voltage-Min | 0.922 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 42.5 mm |