XCVU095-1FFVC2104I vs XCVU095-1FFVB1760E feature comparison

XCVU095-1FFVC2104I AMD Xilinx

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XCVU095-1FFVB1760E AMD

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Package Description BGA-2104
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B2104
JESD-609 Code e1 e1
Length 47.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 768
Number of Inputs 832
Number of Logic Cells 1176000
Number of Outputs 832
Number of Terminals 2104
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 768 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA2104,46X46,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.04 mm
Supply Voltage-Max 0.979 V
Supply Voltage-Min 0.922 V
Supply Voltage-Nom 0.95 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 47.5 mm
Base Number Matches 2 2

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