XCVU095-1FFVC2104I
vs
XCVU095-1FFVB1760E
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Package Description |
BGA-2104
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.7.B
|
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PBGA-B2104
|
|
JESD-609 Code |
e1
|
e1
|
Length |
47.5 mm
|
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
768
|
|
Number of Inputs |
832
|
|
Number of Logic Cells |
1176000
|
|
Number of Outputs |
832
|
|
Number of Terminals |
2104
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
768 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA2104,46X46,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
Seated Height-Max |
4.04 mm
|
|
Supply Voltage-Max |
0.979 V
|
|
Supply Voltage-Min |
0.922 V
|
|
Supply Voltage-Nom |
0.95 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
47.5 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare XCVU095-1FFVC2104I with alternatives