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XCV2000E-8FG860I vs XCV2000E-7FGG860C feature comparison

XCV2000E-8FG860I AMD Xilinx

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XCV2000E-7FGG860C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-860 BGA, BGA860,42X42,40
Pin Count 860 860
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 400 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.42 ns
JESD-30 Code S-PBGA-B860 S-PBGA-B860
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 518400
Number of Inputs 660 660
Number of Logic Cells 43200 43200
Number of Outputs 660 660
Number of Terminals 860 860
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA860,42X42,40 BGA860,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Temperature Grade OTHER
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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