XCV2000E-8FG860I
vs
XCV2000E-6FGG860C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-860
BGA, BGA860,42X42,40
Pin Count
860
860
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
416 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.4 ns
0.47 ns
JESD-30 Code
S-PBGA-B860
S-PBGA-B860
JESD-609 Code
e0
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9600
9600
Number of Equivalent Gates
518400
518400
Number of Inputs
660
660
Number of Logic Cells
43200
43200
Number of Outputs
660
660
Number of Terminals
860
860
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
9600 CLBS, 518400 GATES
9600 CLBS, 518400 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA860,42X42,40
BGA860,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Pbfree Code
Temperature Grade
OTHER
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