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XCV2000E-7FGG860C vs XCV2000E-7FG860I feature comparison

XCV2000E-7FGG860C AMD Xilinx

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XCV2000E-7FG860I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA860,42X42,40 FBGA-860
Pin Count 860 860
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 400 MHz 400 MHz
Combinatorial Delay of a CLB-Max 0.42 ns 0.42 ns
JESD-30 Code S-PBGA-B860 S-PBGA-B860
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 518400
Number of Inputs 660 660
Number of Logic Cells 43200 43200
Number of Outputs 660 660
Number of Terminals 860 860
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA860,42X42,40 BGA860,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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