XCV2000E-6FGG860C
vs
XCV2000E-6FG860I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XILINX INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
BGA, BGA860,42X42,40
FBGA-860
Pin Count
860
860
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Clock Frequency-Max
357 MHz
357 MHz
Combinatorial Delay of a CLB-Max
0.47 ns
0.47 ns
JESD-30 Code
S-PBGA-B860
S-PBGA-B860
JESD-609 Code
e1
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9600
9600
Number of Equivalent Gates
518400
518400
Number of Inputs
660
Number of Logic Cells
43200
Number of Outputs
660
Number of Terminals
860
860
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
9600 CLBS, 518400 GATES
9600 CLBS, 518400 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA860,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
2
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