XCV2000E-6FGG860C vs XCV2000E-6FG860I feature comparison

XCV2000E-6FGG860C AMD Xilinx

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XCV2000E-6FG860I Rochester Electronics LLC

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Pbfree Code Yes No
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description BGA, BGA860,42X42,40 FBGA-860
Pin Count 860 860
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Clock Frequency-Max 357 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.47 ns
JESD-30 Code S-PBGA-B860 S-PBGA-B860
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9600 9600
Number of Equivalent Gates 518400 518400
Number of Inputs 660
Number of Logic Cells 43200
Number of Outputs 660
Number of Terminals 860 860
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 9600 CLBS, 518400 GATES 9600 CLBS, 518400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA860,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 2

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