XCV1000-6BGG560I
vs
5962R9957401NUA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LBGA,
PLASTIC, BGA-560
Pin Count
560
560
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
333 MHz
Combinatorial Delay of a CLB-Max
0.6 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e1
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
1124022
1124022
Number of Terminals
560
560
Organization
6144 CLBS, 1124022 GATES
1124022 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
2
ECCN Code
3A001.A.2.C
Number of Inputs
404
Number of Logic Cells
27648
Number of Outputs
404
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Equivalence Code
BGA560,33X33,50
Screening Level
MIL-PRF-38535
Temperature Grade
MILITARY
Compare XCV1000-6BGG560I with alternatives
Compare 5962R9957401NUA with alternatives