XCV1000-6BGG560I
vs
XCV1000E-7BGG560C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LBGA,
BGA-560
Pin Count
560
560
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
333 MHz
400 MHz
Combinatorial Delay of a CLB-Max
0.6 ns
0.42 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e1
e1
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6144
6144
Number of Equivalent Gates
1124022
331776
Number of Terminals
560
560
Organization
6144 CLBS, 1124022 GATES
6144 CLBS, 331776 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
2.625 V
1.89 V
Supply Voltage-Min
2.375 V
1.71 V
Supply Voltage-Nom
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Number of Inputs
404
Number of Logic Cells
27648
Number of Outputs
404
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Equivalence Code
BGA560,33X33,50
Temperature Grade
OTHER
Compare XCV1000-6BGG560I with alternatives
Compare XCV1000E-7BGG560C with alternatives