XCF01SVO20CES vs XC1701SOG20C feature comparison

XCF01SVO20CES AMD Xilinx

Buy Now Datasheet

XC1701SOG20C AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP,
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e3
Length 6.5024 mm 12.827 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX1 1MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.19 mm 2.6416 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.5184 mm
Base Number Matches 1 2
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare XCF01SVO20CES with alternatives

Compare XC1701SOG20C with alternatives