XC1701SOG20C vs XQ1704LCCG44B feature comparison

XC1701SOG20C AMD Xilinx

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XQ1704LCCG44B AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC LCC
Package Description SOP, QCCJ,
Pin Count 20 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDSO-G20 S-CQCC-J44
JESD-609 Code e3 e3
Length 12.827 mm 16.51 mm
Memory Density 1048576 bit 4194304 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 20 44
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1MX1 4MX1
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6416 mm 4.826 mm
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5184 mm 16.51 mm
Base Number Matches 1 1
Pbfree Code Yes
Screening Level MIL-PRF-38535

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