XC1701SOG20C
vs
XQ1704LCCG44B
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
SOIC
LCC
Package Description
SOP,
QCCJ,
Pin Count
20
44
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code
R-PDSO-G20
S-CQCC-J44
JESD-609 Code
e3
e3
Length
12.827 mm
16.51 mm
Memory Density
1048576 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
20
44
Number of Words
1048576 words
4194304 words
Number of Words Code
1000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1MX1
4MX1
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6416 mm
4.826 mm
Supply Voltage-Max (Vsup)
5.25 V
3.6 V
Supply Voltage-Min (Vsup)
4.75 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5184 mm
16.51 mm
Base Number Matches
1
1
Pbfree Code
Yes
Screening Level
MIL-PRF-38535
Compare XC1701SOG20C with alternatives
Compare XQ1704LCCG44B with alternatives