XCF01SVO20CES vs XCF02SVO20C feature comparison

XCF01SVO20CES AMD Xilinx

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XCF02SVO20C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code TSSOP TSSOP
Package Description TSSOP, PLASTIC, TSSOP-20
Pin Count 20 20
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Length 6.5024 mm 6.5024 mm
Memory Density 1048576 bit 2097152 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX1 2MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.19 mm 1.19 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Data Retention Time-Min 20
Endurance 20000 Write/Erase Cycles
Package Equivalence Code TSSOP20,.25
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.001 A
Supply Current-Max 0.01 mA
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE

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