XC95288XL-7BGG256I
vs
XC95288XL-10BGG352C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, PLASTIC, BGA-256
LBGA,
Pin Count
256
352
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
Additional Feature
YES
288 MACROCELLS
Clock Frequency-Max
125 MHz
100 MHz
In-System Programmable
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B352
JESD-609 Code
e1
e1
JTAG BST
YES
Length
27 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
192
192
Number of Inputs
192
Number of Macro Cells
288
Number of Outputs
192
Number of Terminals
256
352
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 192 I/O
0 DEDICATED INPUTS, 192 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,20X20,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
260
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
7.5 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
1.7 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
35 mm
Base Number Matches
2
1
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