XC95288XL-10BGG352C vs XC95288XL-10BG256I feature comparison

XC95288XL-10BGG352C AMD Xilinx

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XC95288XL-10BG256I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, PLASTIC, BGA-256
Pin Count 352 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 288 MACROCELLS YES
Clock Frequency-Max 100 MHz 100 MHz
JESD-30 Code S-PBGA-B352 S-PBGA-B256
JESD-609 Code e1 e0
Length 35 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 192
Number of Terminals 352 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA352,26X26,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 27 mm
Base Number Matches 1 2
Pbfree Code No
ECCN Code EAR99
Factory Lead Time 52 Weeks
In-System Programmable YES
JTAG BST YES
Number of Inputs 192
Number of Macro Cells 288
Number of Outputs 192

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Compare XC95288XL-10BG256I with alternatives