XC95288XL-6BGG352C
vs
XC95288XL-10BGG352C
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
LBGA,
|
| Pin Count |
352
|
352
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
288 MACROCELLS
|
288 MACROCELLS
|
| Clock Frequency-Max |
151.5 MHz
|
100 MHz
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| JESD-609 Code |
e1
|
e1
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
192
|
192
|
| Number of Terminals |
352
|
352
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
0 DEDICATED INPUTS, 192 I/O
|
0 DEDICATED INPUTS, 192 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
6 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC95288XL-6BGG352C with alternatives
Compare XC95288XL-10BGG352C with alternatives