XC95288XL-10BG256I vs XC95288XL-6BGG352C feature comparison

XC95288XL-10BG256I AMD Xilinx

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XC95288XL-6BGG352C AMD Xilinx

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 LBGA,
Pin Count 256 352
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Additional Feature YES 288 MACROCELLS
Clock Frequency-Max 100 MHz 151.5 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B256 S-PBGA-B352
JESD-609 Code e0 e1
JTAG BST YES
Length 27 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 192
Number of Inputs 192
Number of Macro Cells 288
Number of Outputs 192
Number of Terminals 256 352
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 10 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 35 mm
Base Number Matches 1 1

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